This is the main project that I’ve been working on since joining Purdue. It started as a collaboration between Intel, Advanced Cooling Technologies (ACT) and Purdue, before evolving to add Modine as a collaborator. My role in this project has been to design topology-optimized heat sinks for immersion cooling and evaluate them using our custom-built immersion cooling chamber.
You can find a description of our topology optimization formulation here:
We are currently using this workflow to design topology-optimized heat sinks, including:
- 3D-printed solid copper heat sinks
- 3D-printed vapor chamber heat sinks
- Conventionally machined vapor chamber heat sinks
Here is a poster that showcases the application and also our experimental test facility, which we are going to use to characterize heat sinks in the near future: